AGLN015V2-QNG68I
vs
AGL1000V5-FG256I
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68
|
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
8 Weeks
|
8 Weeks
|
| JESD-30 Code |
S-XQCC-N68
|
S-PBGA-B256
|
| Length |
8 mm
|
17 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
384
|
|
| Number of Equivalent Gates |
15000
|
1000000
|
| Number of Terminals |
68
|
256
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
384 CLBS, 15000 GATES
|
1000000 GATES
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
BGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.7 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.14 V
|
1.425 V
|
| Supply Voltage-Nom |
1.2 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.4 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Width |
8 mm
|
17 mm
|
| Base Number Matches |
1
|
2
|
| JESD-609 Code |
|
e0
|
| Number of Inputs |
|
177
|
| Number of Logic Cells |
|
24576
|
| Number of Outputs |
|
177
|
| Package Equivalence Code |
|
BGA256,16X16,40
|
| Terminal Finish |
|
TIN LEAD SILVER
|
|
|
|
Compare AGLN015V2-QNG68I with alternatives
Compare AGL1000V5-FG256I with alternatives