AGL1000V2-CS281
vs
M1AGL250V2-FG144YI
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI SOC PRODUCTS GROUP
|
Package Description |
10 X 10 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, CSP-281
|
,
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
8 Weeks
|
|
Clock Frequency-Max |
108 MHz
|
250 MHz
|
JESD-30 Code |
S-PBGA-B281
|
S-PBGA-B144
|
Length |
10 mm
|
13 mm
|
Number of Equivalent Gates |
1000000
|
250000
|
Number of Inputs |
215
|
|
Number of Logic Cells |
24576
|
|
Number of Outputs |
215
|
|
Number of Terminals |
281
|
144
|
Operating Temperature-Max |
85 °C
|
100 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
24576 CLBS, 1000000 GATES
|
250000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
LBGA
|
Package Equivalence Code |
BGA281,19X19,20
|
BGA144,12X12,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.05 mm
|
1.55 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
10 mm
|
13 mm
|
Base Number Matches |
3
|
3
|
Additional Feature |
|
TERM PITCH-MIN
|
JESD-609 Code |
|
e0
|
Moisture Sensitivity Level |
|
3
|
Terminal Finish |
|
TIN LEAD
|
|
|
|
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