AGL1000V2-CS281
vs
AGL400V2-CS196
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
ACTEL CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
10 X 10 MM, 1.05 MM HEIGHT, 0.50 MM PITCH, CSP-281
|
8 X 8 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, CSP-196
|
| Reach Compliance Code |
compliant
|
compliant
|
| Clock Frequency-Max |
108 MHz
|
108 MHz
|
| JESD-30 Code |
S-PBGA-B281
|
S-PBGA-B196
|
| JESD-609 Code |
e0
|
|
| Length |
10 mm
|
8 mm
|
| Number of CLBs |
24576
|
|
| Number of Equivalent Gates |
1000000
|
400000
|
| Number of Inputs |
215
|
143
|
| Number of Logic Cells |
24576
|
9216
|
| Number of Outputs |
215
|
143
|
| Number of Terminals |
281
|
196
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Organization |
24576 CLBS, 1000000 GATES
|
9126 CLBS, 400000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Equivalence Code |
BGA281,19X19,20
|
BGA196,14X14,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.05 mm
|
1.2 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
10 mm
|
8 mm
|
| Base Number Matches |
3
|
3
|
| HTS Code |
|
8542.39.00.01
|
| Factory Lead Time |
|
8 Weeks
|
|
|
|
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