AFS600-1FGG256I
vs
P1AFS600-2FG256I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
FBGA-256
FBGA-256
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.31.00.01
Factory Lead Time
14 Weeks
16 Weeks
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e1
e0
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
600000
600000
Number of Inputs
119
119
Number of Outputs
119
119
Number of Terminals
256
256
Operating Temperature-Max
100 °C
100 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
13824 CLBS, 600000 GATES
600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Packing Method
TRAY
Peak Reflow Temperature (Cel)
250
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.7 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Tin/Lead (Sn/Pb)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
20
Width
17 mm
17 mm
Base Number Matches
3
1
ECCN Code
3A991.D
Samacsys Manufacturer
Microchip
Number of Logic Cells
13824
Package Equivalence Code
BGA256,16X16,40
Compare AFS600-1FGG256I with alternatives
Compare P1AFS600-2FG256I with alternatives