AFS600-1FGG256I vs U1AFS600-FGG256YC feature comparison

AFS600-1FGG256I Actel Corporation

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U1AFS600-FGG256YC Microsemi FPGA & SoC

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ACTEL CORP MICROSEMI SOC PRODUCTS GROUP
Package Description 1 MM PITCH, GREEN, FBGA-256 ,
Reach Compliance Code compliant unknown
Clock Frequency-Max 350 MHz
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e1
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 13824
Number of Equivalent Gates 600000 600000
Number of Inputs 119 159
Number of Logic Cells 13824 13824
Number of Outputs 119 159
Number of Terminals 256 256
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 13824 CLBS, 600000 GATES 600000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.68 mm 1.7 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm 17 mm
Base Number Matches 3 2
HTS Code 8542.39.00.01
Peak Reflow Temperature (Cel) 250
Time@Peak Reflow Temperature-Max (s) 30

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