AFS600-1FGG256 vs P1AFS600-2FG256I feature comparison

AFS600-1FGG256 Microchip Technology Inc

Buy Now Datasheet

P1AFS600-2FG256I Microchip Technology Inc

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description FBGA-256 FBGA-256
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.31.00.01
Factory Lead Time 14 Weeks 16 Weeks
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1 e0
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 13824
Number of Equivalent Gates 600000 600000
Number of Inputs 119 119
Number of Outputs 119 119
Number of Terminals 256 256
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 13824 CLBS, 600000 GATES 600000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Packing Method TRAY
Peak Reflow Temperature (Cel) 250 225
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.68 mm 1.7 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 20
Width 17 mm 17 mm
Base Number Matches 22 1
ECCN Code 3A991.D
Samacsys Manufacturer Microchip
Number of Logic Cells 13824

Compare AFS600-1FGG256 with alternatives

Compare P1AFS600-2FG256I with alternatives