P1AFS600-2FG256I
vs
M1AFS600-2FGG256
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
ACTEL CORP
Package Description
FBGA-256
1 MM PITCH, GREEN, FBGA-256
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.D
HTS Code
8542.31.00.01
Factory Lead Time
16 Weeks
Samacsys Manufacturer
Microchip
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e1
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
600000
600000
Number of Inputs
119
119
Number of Logic Cells
13824
13824
Number of Outputs
119
119
Number of Terminals
256
256
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
600000 GATES
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.68 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
Tin/Lead (Sn/Pb)
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
20
Width
17 mm
17 mm
Base Number Matches
3
3
Clock Frequency-Max
350 MHz
Number of CLBs
13824
Temperature Grade
OTHER
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