ADXRS646BBGZ
vs
ADXRS646TBGZ-EP-RL
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA-32
|
BGA-32
|
| Pin Count |
32
|
32
|
| Manufacturer Package Code |
BG-32-3
|
BG-32-3
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
7A994
|
7A994
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
| Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
| JESD-30 Code |
S-CBGA-B32
|
S-CBGA-B32
|
| JESD-609 Code |
e3
|
e3
|
| Length |
6.85 mm
|
6.85 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
FBGA
|
FBGA
|
| Package Equivalence Code |
BGA32,7X7,32
|
BGA32,7X7,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, FINE PITCH
|
GRID ARRAY, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
3.8 mm
|
3.8 mm
|
| Supply Voltage-Max (Vsup) |
6.25 V
|
6.25 V
|
| Supply Voltage-Min (Vsup) |
5.75 V
|
5.75 V
|
| Supply Voltage-Nom (Vsup) |
6 V
|
6 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIMOS
|
BIMOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Width |
6.85 mm
|
6.85 mm
|
| Base Number Matches |
2
|
1
|
| Moisture Sensitivity Level |
|
1
|
|
|
|
Compare ADXRS646BBGZ with alternatives
Compare ADXRS646TBGZ-EP-RL with alternatives