ADS774SH
vs
HS574AB/LCC
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICRO NETWORKS CORP
|
SATCON ELECTRONICS
|
| Part Package Code |
DIP
|
QLCC
|
| Package Description |
DIP, DIP28,.6
|
QCCN,
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
10 V
|
16.5 V
|
| Analog Input Voltage-Min |
-10 V
|
-16.5 V
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
R-CDIP-T28
|
S-CQCC-N28
|
| JESD-609 Code |
e0
|
|
| Length |
35.56 mm
|
11.43 mm
|
| Linearity Error-Max (EL) |
0.0244%
|
0.012%
|
| Negative Supply Voltage-Nom |
-15 V
|
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Bit Code |
BINARY, OFFSET BINARY
|
BINARY, OFFSET BINARY
|
| Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
QCCN
|
| Package Equivalence Code |
DIP28,.6
|
LCC28,.45SQ
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
IN-LINE
|
CHIP CARRIER
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample and Hold / Track and Hold |
SAMPLE
|
|
| Seated Height-Max |
4.45 mm
|
2.29 mm
|
| Supply Current-Max |
24 mA
|
|
| Supply Voltage-Nom |
5 V
|
15 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
15.24 mm
|
11.43 mm
|
| Base Number Matches |
2
|
3
|
| Conversion Time-Max |
|
25 µs
|
|
|
|
Compare ADS774SH with alternatives
Compare HS574AB/LCC with alternatives