ADS574JH
vs
MX574AKEQI-T
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICRO NETWORKS CORP
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
DIP
|
QLCC
|
Package Description |
0.600 INCH, DOUBLE WIDTH, HERMETIC SEALED, CERAMIC, DIP-28
|
QCCJ,
|
Pin Count |
28
|
28
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Input Voltage-Max |
16.5 V
|
10 V
|
Analog Input Voltage-Min |
-16.5 V
|
-10 V
|
Conversion Time-Max |
25 µs
|
25 µs
|
Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
JESD-30 Code |
R-CDIP-T28
|
S-PQCC-J28
|
JESD-609 Code |
e0
|
|
Length |
35.56 mm
|
11.5062 mm
|
Linearity Error-Max (EL) |
0.024%
|
0.012%
|
Negative Supply Voltage-Nom |
-15 V
|
-15 V
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
12
|
12
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Output Bit Code |
BINARY
|
BINARY, OFFSET BINARY
|
Output Format |
PARALLEL, WORD
|
PARALLEL, WORD
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
QCCJ
|
Package Equivalence Code |
DIP28,.6
|
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
IN-LINE
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Sample Rate |
0.0455 MHz
|
|
Seated Height-Max |
4.45 mm
|
4.57 mm
|
Supply Current-Max |
20 mA
|
|
Supply Voltage-Nom |
5 V
|
15 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
BICMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
J BEND
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
15.24 mm
|
11.5062 mm
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
No
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare ADS574JH with alternatives
Compare MX574AKEQI-T with alternatives