ADM3101EACPZ-REEL
vs
ISL83073EIBZA
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QFN
|
SOIC
|
| Package Description |
3 X 3 MM, ROHS COMPLIANT, MO-220VEED-1, LFCSP-12
|
SOP,
|
| Pin Count |
12
|
14
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
DUMMY VAL
|
|
| Differential Output |
NO
|
YES
|
| Driver Number of Bits |
1
|
1
|
| Input Characteristics |
SCHMITT TRIGGER
|
DIFFERENTIAL SCHMITT TRIGGER
|
| Interface IC Type |
LINE TRANSCEIVER
|
LINE TRANSCEIVER
|
| Interface Standard |
EIA-232; TIA-232; V.28
|
EIA-422; EIA-485
|
| JESD-30 Code |
S-XQCC-N12
|
R-PDSO-G14
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
8.65 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
12
|
14
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
SOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Receiver Number of Bits |
1
|
1
|
| Seated Height-Max |
1 mm
|
1.75 mm
|
| Supply Voltage-Max |
5.5 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
3 mm
|
3.9 mm
|
| Base Number Matches |
2
|
4
|
| Receive Delay-Max |
|
120 ns
|
| Transmit Delay-Max |
|
800 ns
|
|
|
|
Compare ADM3101EACPZ-REEL with alternatives
Compare ISL83073EIBZA with alternatives