ADG819BCB vs ADG819BCBZ-REEL7 feature comparison

ADG819BCB Analog Devices Inc

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ADG819BCBZ-REEL7 Analog Devices Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ANALOG DEVICES INC ANALOG DEVICES INC
Part Package Code BGA BGA
Package Description VFBGA, BGA6,2X3,20 MICRO, CSP-6
Pin Count 6 6
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPDT SPDT
JESD-30 Code R-XBGA-B6 R-XBGA-B6
JESD-609 Code e0 e1
Length 2.18 mm 2.18 mm
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 6 6
Off-state Isolation-Nom 71 dB 71 dB
On-state Resistance Match-Nom 0.06 Ω 0.06 Ω
On-state Resistance-Max (Ron) 1.4 Ω 1.4 Ω
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code VFBGA VFBGA
Package Equivalence Code BGA6,2X3,20 BGA6,2X3,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.67 mm 0.67 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 1.8 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Switch-off Time-Max 16 ns 16 ns
Switch-on Time-Max 60 ns 60 ns
Switching BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Width 1.14 mm 1.14 mm
Base Number Matches 6 1
Pbfree Code No
Manufacturer Package Code CB-6-1
ECCN Code EAR99
Samacsys Manufacturer Analog Devices
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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Compare ADG819BCBZ-REEL7 with alternatives