ADG819BCB vs ADG752BRMZ-REEL7 feature comparison

ADG819BCB Analog Devices Inc

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ADG752BRMZ-REEL7 Analog Devices Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ANALOG DEVICES INC ANALOG DEVICES INC
Part Package Code BGA SOIC
Package Description VFBGA, BGA6,2X3,20 MICRO, SOIC-8
Pin Count 6 8
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPDT SPDT
JESD-30 Code R-XBGA-B6 S-PDSO-G8
JESD-609 Code e0 e3
Length 2.18 mm 3 mm
Number of Channels 1 1
Number of Functions 1 1
Number of Terminals 6 8
Off-state Isolation-Nom 71 dB 80 dB
On-state Resistance Match-Nom 0.06 Ω 0.2 Ω
On-state Resistance-Max (Ron) 1.4 Ω 50 Ω
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code VFBGA TSSOP
Package Equivalence Code BGA6,2X3,20
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.67 mm 1.09 mm
Supply Voltage-Max (Vsup) 5.5 V 3.3 V
Supply Voltage-Min (Vsup) 1.8 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Switch-off Time-Max 16 ns 8 ns
Switch-on Time-Max 60 ns 18 ns
Switching BREAK-BEFORE-MAKE
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Matte Tin (Sn) - annealed
Terminal Form BALL GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position BOTTOM DUAL
Width 1.14 mm 3 mm
Base Number Matches 6 1
Pbfree Code Yes
Additional Feature CAN ALSO BE OPERATED FROM 4.5 TO 5.5V
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) 260

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