ADG513BN vs ADG663BRU feature comparison

ADG513BN Analog Devices Inc

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ADG663BRU Analog Devices Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ANALOG DEVICES INC ANALOG DEVICES INC
Part Package Code DIP TSSOP
Package Description PLASTIC, DIP-16 TSSOP, TSSOP16,.25
Pin Count 16 16
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST SPST
JESD-30 Code R-PDIP-T16 R-PDSO-G16
JESD-609 Code e0 e0
Length 20.13 mm 5 mm
Neg Supply Voltage-Max (Vsup) -5.5 V -5.5 V
Neg Supply Voltage-Min (Vsup) -4.5 V -4.5 V
Neg Supply Voltage-Nom (Vsup) -5 V -5 V
Normal Position NO/NC NO/NC
Number of Channels 1 1
Number of Functions 4 4
Number of Terminals 16 16
Off-state Isolation-Nom 68 dB 70 dB
On-state Resistance-Max (Ron) 50 Ω 38 Ω
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output SEPARATE OUTPUT SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP TSSOP
Package Equivalence Code DIP16,.3 TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883
Seated Height-Max 5.33 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Switch-off Time-Max 150 ns 120 ns
Switch-on Time-Max 375 ns 275 ns
Switching BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Width 7.62 mm 4.4 mm
Base Number Matches 2 1

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