ADG513BN
vs
ADG663BRU
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ANALOG DEVICES INC
ANALOG DEVICES INC
Part Package Code
DIP
TSSOP
Package Description
PLASTIC, DIP-16
TSSOP, TSSOP16,.25
Pin Count
16
16
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPST
SPST
JESD-30 Code
R-PDIP-T16
R-PDSO-G16
JESD-609 Code
e0
e0
Length
20.13 mm
5 mm
Neg Supply Voltage-Max (Vsup)
-5.5 V
-5.5 V
Neg Supply Voltage-Min (Vsup)
-4.5 V
-4.5 V
Neg Supply Voltage-Nom (Vsup)
-5 V
-5 V
Normal Position
NO/NC
NO/NC
Number of Channels
1
1
Number of Functions
4
4
Number of Terminals
16
16
Off-state Isolation-Nom
68 dB
70 dB
On-state Resistance-Max (Ron)
50 Ω
38 Ω
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output
SEPARATE OUTPUT
SEPARATE OUTPUT
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
TSSOP
Package Equivalence Code
DIP16,.3
TSSOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883
Seated Height-Max
5.33 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Switch-off Time-Max
150 ns
120 ns
Switch-on Time-Max
375 ns
275 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Pitch
2.54 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
4.4 mm
Base Number Matches
2
1
Compare ADG513BN with alternatives
Compare ADG663BRU with alternatives