ADG509AKNZ
vs
HI9P0201HS-9Z
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
DIP
|
SOICW
|
| Package Description |
LEAD FREE, PLASTIC, MS-001AB, DIP-16
|
LEAD FREE, SOIC-16
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
N-16
|
M16.3
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Analog Devices
|
Renesas Electronics
|
| Additional Feature |
ALSO OPERATES WITH 10.8 V TO 16.5 V SINGLE SUPPLY
|
|
| Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
SPST
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
| JESD-609 Code |
e3
|
e3
|
| Length |
20.07 mm
|
10.3 mm
|
| Neg Supply Voltage-Max (Vsup) |
-16.5 V
|
|
| Neg Supply Voltage-Min (Vsup) |
-10.8 V
|
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Number of Channels |
4
|
1
|
| Number of Functions |
1
|
4
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
68 dB
|
72 dB
|
| On-state Resistance Match-Nom |
22.5 Ω
|
0.9 Ω
|
| On-state Resistance-Max (Ron) |
450 Ω
|
50 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.33 mm
|
2.65 mm
|
| Signal Current-Max |
0.02 A
|
|
| Supply Current-Max (Isup) |
1.5 mA
|
|
| Supply Voltage-Max (Vsup) |
16.5 V
|
|
| Supply Voltage-Min (Vsup) |
10.8 V
|
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
YES
|
| Switch-off Time-Max |
300 ns
|
50 ns
|
| Switch-on Time-Max |
300 ns
|
50 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
| Width |
7.62 mm
|
7.5 mm
|
| Base Number Matches |
2
|
3
|
| Factory Lead Time |
|
26 Weeks, 1 Day
|
| Moisture Sensitivity Level |
|
3
|
|
|
|
Compare ADG509AKNZ with alternatives
Compare HI9P0201HS-9Z with alternatives