ADG507ATQ/883B
vs
HI1-0507/883
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
INTERSIL CORP
|
Part Package Code |
DIP
|
DIP
|
Package Description |
CERAMIC, DIP-28
|
,
|
Pin Count |
28
|
28
|
Reach Compliance Code |
unknown
|
compliant
|
Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
DIFFERENTIAL MULTIPLEXER
|
JESD-30 Code |
R-GDIP-T28
|
R-GDIP-T28
|
JESD-609 Code |
e0
|
|
Moisture Sensitivity Level |
NOT SPECIFIED
|
|
Neg Supply Voltage-Max (Vsup) |
-16.5 V
|
|
Neg Supply Voltage-Min (Vsup) |
-10.8 V
|
|
Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
Number of Channels |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Off-state Isolation-Nom |
68 dB
|
68 dB
|
On-state Resistance Match-Nom |
22.5 Ω
|
9 Ω
|
On-state Resistance-Max (Ron) |
450 Ω
|
300 Ω
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
MILITARY
|
Not Qualified
|
Screening Level |
MIL-STD-883 Class B
|
|
Seated Height-Max |
5.59 mm
|
|
Supply Voltage-Max (Vsup) |
16.5 V
|
|
Supply Voltage-Min (Vsup) |
10.8 V
|
|
Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
Surface Mount |
NO
|
NO
|
Switch-off Time-Max |
300 ns
|
500 ns
|
Switch-on Time-Max |
300 ns
|
500 ns
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
15.24 mm
|
|
Base Number Matches |
2
|
4
|
HTS Code |
|
8542.39.00.01
|
|
|
|
Compare ADG507ATQ/883B with alternatives
Compare HI1-0507/883 with alternatives