ADG221KNZ
vs
DG509ABK
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Not Recommended
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
TEMIC SEMICONDUCTORS
|
| Part Package Code |
DIP
|
|
| Package Description |
PLASTIC, DIP-16
|
DIP-16
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
N-16
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Analog IC - Other Type |
SPST
|
DIFFERENTIAL MULTIPLEXER
|
| JESD-30 Code |
R-PDIP-T16
|
R-GDIP-T16
|
| JESD-609 Code |
e3
|
|
| Length |
19.055 mm
|
|
| Neg Supply Voltage-Nom (Vsup) |
-15 V
|
-15 V
|
| Normal Position |
NC
|
|
| Number of Channels |
1
|
4
|
| Number of Functions |
4
|
1
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
80 dB
|
|
| On-state Resistance Match-Nom |
5 Ω
|
|
| On-state Resistance-Max (Ron) |
90 Ω
|
400 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-25 °C
|
| Output |
SEPARATE OUTPUT
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.32 mm
|
|
| Supply Voltage-Nom (Vsup) |
15 V
|
15 V
|
| Surface Mount |
NO
|
NO
|
| Switch-off Time-Max |
250 ns
|
|
| Switch-on Time-Max |
300 ns
|
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare ADG221KNZ with alternatives
Compare DG509ABK with alternatives