ADC0848BCV
vs
ADC0848CCVX
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
PLASTIC, LCC-28
|
PLASTIC, LCC-28
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Input Voltage-Max |
5 V
|
5 V
|
Analog Input Voltage-Min |
|
|
Conversion Time-Max |
60 µs
|
60 µs
|
Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
JESD-609 Code |
e0
|
e0
|
Length |
11.43 mm
|
11.43 mm
|
Linearity Error-Max (EL) |
0.1953%
|
0.3906%
|
Moisture Sensitivity Level |
2A
|
2A
|
Number of Analog In Channels |
8
|
8
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Bit Code |
BINARY
|
BINARY
|
Output Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
245
|
245
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Sample Rate |
0.033 MHz
|
0.033 MHz
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
11.43 mm
|
11.43 mm
|
Base Number Matches |
4
|
2
|
|
|
|
Compare ADC0848BCV with alternatives
Compare ADC0848CCVX with alternatives