ADC08351CILQX
vs
ADC08351CILQ
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
QFN
|
QFN
|
Package Description |
HVQCCN, LCC24,.16X.2,20
|
PLASTIC, LLP, CSP-24
|
Pin Count |
24
|
24
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog Input Voltage-Max |
3 V
|
3 V
|
Analog Input Voltage-Min |
0.735 V
|
0.735 V
|
Conversion Time-Max |
0.023 µs
|
0.023 µs
|
Converter Type |
ADC, RESISTANCE LADDER
|
ADC, RESISTANCE LADDER
|
JESD-30 Code |
R-PQCC-N24
|
R-PQCC-N24
|
JESD-609 Code |
e0
|
|
Length |
5 mm
|
5 mm
|
Linearity Error-Max (EL) |
0.5469%
|
0.5469%
|
Moisture Sensitivity Level |
1
|
|
Number of Analog In Channels |
1
|
1
|
Number of Bits |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Bit Code |
BINARY
|
BINARY
|
Output Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC24,.16X.2,20
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
235
|
|
Qualification Status |
Not Qualified
|
|
Sample Rate |
42 MHz
|
42 MHz
|
Sample and Hold / Track and Hold |
SAMPLE
|
SAMPLE
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
20
|
|
Width |
4 mm
|
4 mm
|
Base Number Matches |
2
|
4
|
|
|
|