ADC08060CIMTX/NOPB
vs
ADC08060CIMT
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
| Package Description |
PLASTIC, TSSOP-24
|
PLASTIC, MO-153AD, TSSOP-24
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Input Voltage-Max |
1.9 V
|
3.6 V
|
| Analog Input Voltage-Min |
0.3 V
|
|
| Converter Type |
ADC, RESISTANCE LADDER
|
ADC, RESISTANCE LADDER
|
| JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G24
|
| JESD-609 Code |
e3
|
e0
|
| Length |
7.8 mm
|
7.8 mm
|
| Linearity Error-Max (EL) |
0.5078%
|
0.5078%
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Bit Code |
BINARY
|
BINARY
|
| Output Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Sample Rate |
60 MHz
|
60 MHz
|
| Sample and Hold / Track and Hold |
SAMPLE
|
SAMPLE
|
| Seated Height-Max |
1.2 mm
|
1.1 mm
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
4.4 mm
|
4.4 mm
|
| Base Number Matches |
1
|
4
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
24
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Conversion Time-Max |
|
0.016 µs
|
| Package Equivalence Code |
|
TSSOP24,.25
|
| Technology |
|
CMOS
|
|
|
|
Compare ADC08060CIMTX/NOPB with alternatives
Compare ADC08060CIMT with alternatives