AD8117ABPZ
vs
AD8109ASTZ
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
BGA,
|
LFQFP,
|
| Pin Count |
304
|
80
|
| Reach Compliance Code |
unknown
|
unknown
|
| Additional Feature |
CAN ALSO OPERATE WITH 5V SINGLE SUPPLY
|
|
| Analog IC - Other Type |
CROSS POINT SWITCH
|
CROSS POINT SWITCH
|
| JESD-30 Code |
S-PBGA-B304
|
S-PQFP-G80
|
| JESD-609 Code |
e1
|
e3
|
| Length |
31 mm
|
12 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Neg Supply Voltage-Nom (Vsup) |
-2.5 V
|
-5 V
|
| Number of Channels |
32
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
304
|
80
|
| Off-state Isolation-Nom |
90 dB
|
98 dB
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LFQFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.765 mm
|
1.6 mm
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
MATTE TIN
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
31 mm
|
12 mm
|
| Base Number Matches |
2
|
2
|
| Neg Supply Voltage-Max (Vsup) |
|
-5.5 V
|
| Neg Supply Voltage-Min (Vsup) |
|
-4.5 V
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
|
|
|
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