AD7520SD
vs
MX7531JC/D
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
MAXIM INTEGRATED PRODUCTS INC
Package Description
DIP, DIP16,.3
DIE,
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Converter Type
D/A CONVERTER
D/A CONVERTER
Input Bit Code
OFFSET BINARY, COMPLEMENTARY OFFSET BINARY
BINARY, OFFSET BINARY
Input Format
PARALLEL, WORD
PARALLEL, WORD
JESD-30 Code
R-GDIP-T16
R-XUUC-N18
JESD-609 Code
e0
e0
Length
19.43 mm
Linearity Error-Max (EL)
0.2%
0.2%
Number of Bits
10
12
Number of Functions
1
1
Number of Terminals
16
18
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Package Body Material
CERAMIC, GLASS-SEALED
UNSPECIFIED
Package Code
DIP
DIE
Package Equivalence Code
DIP16,.3
DIE OR CHIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
UNCASED CHIP
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
Settling Time-Nom (tstl)
0.5 µs
0.5 µs
Supply Current-Max
2 mA
2 mA
Supply Voltage-Nom
15 V
15 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
NO LEAD
Terminal Pitch
2.54 mm
Terminal Position
DUAL
UPPER
Width
7.62 mm
Base Number Matches
4
1
Pbfree Code
Part Package Code
DIE
Pin Count
18
Compare AD7520SD with alternatives
Compare MX7531JC/D with alternatives