MX7531JC/D
vs
AD7520LD
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
NATIONAL SEMICONDUCTOR CORP
Part Package Code
DIE
DIP
Package Description
DIE,
DIP, DIP16,.3
Pin Count
18
16
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Converter Type
D/A CONVERTER
D/A CONVERTER
Input Bit Code
BINARY, OFFSET BINARY
OFFSET BINARY, COMPLEMENTARY OFFSET BINARY
Input Format
PARALLEL, WORD
PARALLEL, WORD
JESD-30 Code
R-XUUC-N18
R-GDIP-T16
JESD-609 Code
e0
e0
Linearity Error-Max (EL)
0.2%
0.05%
Number of Bits
12
10
Number of Functions
1
1
Number of Terminals
18
16
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
UNSPECIFIED
CERAMIC, GLASS-SEALED
Package Code
DIE
DIP
Package Equivalence Code
DIE OR CHIP
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
UNCASED CHIP
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Settling Time-Nom (tstl)
0.5 µs
0.5 µs
Supply Current-Max
2 mA
2 mA
Supply Voltage-Nom
15 V
15 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
NO LEAD
THROUGH-HOLE
Terminal Position
UPPER
DUAL
Base Number Matches
1
9
Length
19.43 mm
Seated Height-Max
5.08 mm
Terminal Pitch
2.54 mm
Width
7.62 mm
Compare MX7531JC/D with alternatives
Compare AD7520LD with alternatives