AD73311LARUZ-REEL
vs
SA639DH/01,118
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
TSSOP
|
TSSOP2
|
Package Description |
TSSOP-20
|
PLASTIC, SOT-355, TSSOP-24
|
Pin Count |
20
|
24
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G24
|
Length |
6.5 mm
|
7.8 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
24
|
Operating Temperature-Max |
105 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
4.4 mm
|
4.4 mm
|
Base Number Matches |
2
|
1
|
Manufacturer Package Code |
|
SOT355-1
|
Samacsys Manufacturer |
|
NXP
|
JESD-609 Code |
|
e4
|
Moisture Sensitivity Level |
|
1
|
Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
|
|
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