SA639DH/01,118
vs
AD73311LARU
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS INC
|
Part Package Code |
TSSOP2
|
TSSOP
|
Package Description |
PLASTIC, SOT-355, TSSOP-24
|
TSSOP,
|
Pin Count |
24
|
20
|
Manufacturer Package Code |
SOT355-1
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Samacsys Manufacturer |
NXP
|
|
JESD-30 Code |
R-PDSO-G24
|
R-PDSO-G20
|
JESD-609 Code |
e4
|
e0
|
Length |
7.8 mm
|
6.5 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
24
|
20
|
Operating Temperature-Max |
85 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Supply Voltage-Nom |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
4.4 mm
|
4.4 mm
|
Base Number Matches |
1
|
2
|
Pbfree Code |
|
No
|
Technology |
|
CMOS
|
|
|
|
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-
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