AD6190ARS
vs
LXT317NE
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
INTEL CORP
|
| Part Package Code |
SSOP
|
DIP
|
| Package Description |
SSOP-28
|
DIP, DIP28(UNSPEC)
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G28
|
R-PDIP-T28
|
| JESD-609 Code |
e0
|
e0
|
| Length |
10.2 mm
|
37.402 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
DIP
|
| Package Equivalence Code |
SSOP28,.3
|
DIP28(UNSPEC)
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2 mm
|
6.35 mm
|
| Supply Voltage-Nom |
3.3 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
BIPOLAR
|
CMOS
|
| Telecom IC Type |
CORDLESS TELEPHONE BASEBAND CIRCUIT
|
CORDLESS TELEPHONE BASEBAND CIRCUIT
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.3 mm
|
15.24 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare AD6190ARS with alternatives
Compare LXT317NE with alternatives