AD5424YCP
vs
AD5305BRM-REEL7
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
| Part Package Code |
QFN
|
TSSOP
|
| Package Description |
4 X 4 MM, MO-220VGGD-1, LFCSP-20
|
MO-187BA, MSOP-10
|
| Pin Count |
20
|
10
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog Output Voltage-Max |
5 V
|
5.499 V
|
| Analog Output Voltage-Min |
0.4 V
|
0.001 V
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
PARALLEL, 8 BITS
|
SERIAL
|
| JESD-30 Code |
S-XQCC-N20
|
S-PDSO-G10
|
| JESD-609 Code |
e0
|
e0
|
| Length |
4 mm
|
3 mm
|
| Linearity Error-Max (EL) |
0.0977%
|
0.2441%
|
| Moisture Sensitivity Level |
3
|
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
10
|
| Operating Temperature-Max |
125 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
TSSOP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.1 mm
|
| Settling Time-Nom (tstl) |
0.03 µs
|
6 µs
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
4 mm
|
3 mm
|
| Base Number Matches |
6
|
1
|
| Package Equivalence Code |
|
TSSOP10,.19,20
|
| Settling Time-Max |
|
8 µs
|
| Supply Current-Max |
|
0.9 mA
|
| Supply Voltage-Nom |
|
3 V
|
|
|
|
Compare AD5424YCP with alternatives
Compare AD5305BRM-REEL7 with alternatives