AD5320BRM
vs
DAC121S101CIMM/NOPB
feature comparison
| Pbfree Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
TSSOP,
|
MSOP-8
|
| Pin Count |
8
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Analog Output Voltage-Max |
5.5 V
|
5.5 V
|
| Analog Output Voltage-Min |
|
|
| Converter Type |
D/A CONVERTER
|
D/A CONVERTER
|
| Input Bit Code |
BINARY
|
BINARY
|
| Input Format |
SERIAL
|
SERIAL
|
| JESD-30 Code |
R-PDSO-G8
|
S-PDSO-G8
|
| JESD-609 Code |
e0
|
e3
|
| Length |
3 mm
|
3 mm
|
| Linearity Error-Max (EL) |
0.3906%
|
0.1953%
|
| Moisture Sensitivity Level |
NOT APPLICABLE
|
1
|
| Number of Bits |
12
|
12
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
105 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT APPLICABLE
|
260
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.09 mm
|
| Settling Time-Nom (tstl) |
12 µs
|
8 µs
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT APPLICABLE
|
40
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
TSSOP8,.19
|
| Settling Time-Max |
|
10 µs
|
| Supply Current-Max |
|
0.312 mA
|
|
|
|
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