ACS139HMSR-03
vs
SN74LVC138AGQNR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
INTERSIL CORP
TEXAS INSTRUMENTS INC
Part Package Code
DIE
BGA
Package Description
DIE,
PLASTIC, VFBGA-20
Pin Count
16
20
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
AC
LVC/LCX/Z
Input Conditioning
STANDARD
STANDARD
JESD-30 Code
S-XUUC-N16
R-PBGA-B20
Logic IC Type
2-LINE TO 4-LINE DECODER
3-LINE TO 8-LINE DECODER
Number of Functions
2
1
Number of Terminals
16
20
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
DIE
VFBGA
Package Equivalence Code
DIE OR CHIP
BGA20,4X5,25
Package Shape
SQUARE
RECTANGULAR
Package Style
UNCASED CHIP
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom (Vsup)
5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
NO LEAD
BALL
Terminal Position
UPPER
BOTTOM
Base Number Matches
1
1
Pbfree Code
Rohs Code
Additional Feature
TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS
JESD-609 Code
e0
Length
4 mm
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Packing Method
TR
Peak Reflow Temperature (Cel)
240
Prop. Delay@Nom-Sup
6.7 ns
Propagation Delay (tpd)
22 ns
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
1.65 V
Terminal Finish
TIN LEAD
Terminal Pitch
0.65 mm
Width
3 mm
Compare ACS139HMSR-03 with alternatives
Compare SN74LVC138AGQNR with alternatives