SN74LVC138AGQNR
vs
CD54HCT137H/3
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
TEXAS INSTRUMENTS INC
HARRIS SEMICONDUCTOR
Part Package Code
BGA
Package Description
PLASTIC, VFBGA-20
DIE,
Pin Count
20
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS
ADDRESS LATCHES; 3 ENABLE INPUTS
Family
LVC/LCX/Z
HCT
Input Conditioning
STANDARD
LATCHED
JESD-30 Code
R-PBGA-B20
X-XUUC-N16
JESD-609 Code
e0
Length
4 mm
Logic IC Type
3-LINE TO 8-LINE DECODER
3-LINE TO 8-LINE DECODER
Max I(ol)
0.024 A
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
20
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
VFBGA
DIE
Package Equivalence Code
BGA20,4X5,25
DIE OR CHIP
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
UNCASED CHIP
Packing Method
TR
Peak Reflow Temperature (Cel)
240
Prop. Delay@Nom-Sup
6.7 ns
Propagation Delay (tpd)
22 ns
57 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
4.5 V
Supply Voltage-Nom (Vsup)
1.8 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
BALL
NO LEAD
Terminal Pitch
0.65 mm
Terminal Position
BOTTOM
UPPER
Width
3 mm
Base Number Matches
1
2
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Compare CD54HCT137H/3 with alternatives