A54SX72AFG484I
vs
A54SX72A-FGG484
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
BGA, BGA484,26X26,40
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
Additional Feature
72000 TYPICAL GATES AVAILABLE
72000 TYPICAL GATES AVAILABLE
Clock Frequency-Max
217 MHz
217 MHz
Combinatorial Delay of a CLB-Max
1.5 ns
1.5 ns
JESD-30 Code
S-PBGA-B484
S-PBGA-B484
JESD-609 Code
e0
e1
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of CLBs
6036
6036
Number of Equivalent Gates
108000
108000
Number of Inputs
360
360
Number of Logic Cells
6036
6036
Number of Outputs
360
360
Number of Terminals
484
484
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
6036 CLBS, 108000 GATES
6036 CLBS, 108000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA484,26X26,40
BGA484,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.44 mm
2.44 mm
Supply Voltage-Max
2.75 V
2.75 V
Supply Voltage-Min
2.25 V
2.25 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
Base Number Matches
3
1
Factory Lead Time
10 Weeks
Peak Reflow Temperature (Cel)
250
Time@Peak Reflow Temperature-Max (s)
30
Compare A54SX72AFG484I with alternatives
Compare A54SX72A-FGG484 with alternatives