A54SX72A-CQ256B
vs
5962-0054301QXX
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
QFF,
|
CERAMIC, QFP-256
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Microsemi Corporation
|
|
| Additional Feature |
IT CAN ALSO OPERATE WITH 3.3V AND 5V
|
2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION
|
| Clock Frequency-Max |
217 MHz
|
|
| Combinatorial Delay of a CLB-Max |
1.4 ns
|
|
| JESD-30 Code |
S-CQFP-F256
|
S-CQFP-F256
|
| Length |
36 mm
|
36 mm
|
| Number of CLBs |
4024
|
|
| Number of Equivalent Gates |
108000
|
72000
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
4024 CLBS, 108000 GATES
|
72000 GATES
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFF
|
GQFF
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK, GUARD RING
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883 Class B
|
|
| Seated Height-Max |
3.3 mm
|
3.22 mm
|
| Supply Voltage-Max |
2.75 V
|
2.75 V
|
| Supply Voltage-Min |
2.25 V
|
2.25 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
36 mm
|
36 mm
|
| Base Number Matches |
2
|
1
|
| Package Equivalence Code |
|
TPAK256,3SQ,20
|
|
|
|
Compare A54SX72A-CQ256B with alternatives
Compare 5962-0054301QXX with alternatives