A54SX32A-1BGG329M
vs
A54SX32-3BG329X79
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-329
|
BGA,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
32000 TYPICAL GATES AVAILABLE
|
CAN ALSO BE OPERATED AT 5V; 48000 SYSTEM GATES ALSO AVAILABLE
|
Clock Frequency-Max |
278 MHz
|
350 MHz
|
Combinatorial Delay of a CLB-Max |
1.1 ns
|
0.6 ns
|
JESD-30 Code |
S-PBGA-B329
|
S-PBGA-B329
|
JESD-609 Code |
e1
|
e1
|
Length |
31 mm
|
31 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of CLBs |
2880
|
2880
|
Number of Equivalent Gates |
48000
|
32000
|
Number of Inputs |
249
|
|
Number of Logic Cells |
2880
|
|
Number of Outputs |
249
|
|
Number of Terminals |
329
|
329
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Organization |
2880 CLBS, 48000 GATES
|
2880 CLBS, 32000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA329,23X23,50
|
BGA329,23X23,50
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Packing Method |
TRAY
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.7 mm
|
2.7 mm
|
Supply Voltage-Max |
2.75 V
|
3.6 V
|
Supply Voltage-Min |
2.25 V
|
3 V
|
Supply Voltage-Nom |
2.5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
31 mm
|
31 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare A54SX32A-1BGG329M with alternatives
Compare A54SX32-3BG329X79 with alternatives