A54SX32A-1BGG329M
vs
A54SX32A-1BG329X79
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI CORP
|
ACTEL CORP
|
| Package Description |
BGA, BGA329,23X23,50
|
1.27 MM PITCH, PLASTIC, BGA-329
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
32000 TYPICAL GATES AVAILABLE
|
32000 TYPICAL GATES AVAILABLE
|
| Clock Frequency-Max |
278 MHz
|
278 MHz
|
| Combinatorial Delay of a CLB-Max |
1.1 ns
|
1.1 ns
|
| JESD-30 Code |
S-PBGA-B329
|
S-PBGA-B329
|
| JESD-609 Code |
e1
|
|
| Length |
31 mm
|
31 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
2880
|
2880
|
| Number of Equivalent Gates |
48000
|
48000
|
| Number of Inputs |
249
|
249
|
| Number of Logic Cells |
2880
|
2880
|
| Number of Outputs |
249
|
249
|
| Number of Terminals |
329
|
329
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
2880 CLBS, 48000 GATES
|
2880 CLBS, 48000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA329,23X23,50
|
BGA329,23X23,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.7 mm
|
2.7 mm
|
| Supply Voltage-Max |
2.75 V
|
2.75 V
|
| Supply Voltage-Min |
2.25 V
|
2.25 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
31 mm
|
31 mm
|
| Base Number Matches |
3
|
3
|
| Peak Reflow Temperature (Cel) |
|
245
|
|
|
|
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