A54SX32-1CQG256M
vs
A54SX32A-1CQ256B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
CERAMIC, QFP-256
QFF, TPAK256,3SQ,20
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
48000 SYSTEM GATES AVAILABLE
32000 TYPICAL GATES AVAILABLE
Clock Frequency-Max
280 MHz
278 MHz
Combinatorial Delay of a CLB-Max
0.9 ns
1.1 ns
JESD-30 Code
S-CQFP-F256
S-CQFP-F256
JESD-609 Code
e4
Length
36 mm
36 mm
Number of CLBs
2880
2880
Number of Equivalent Gates
32000
48000
Number of Inputs
228
228
Number of Outputs
228
228
Number of Terminals
256
256
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
2880 CLBS, 32000 GATES
2880 CLBS, 48000 GATES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QFF
QFF
Package Equivalence Code
TPAK256,3SQ,20
TPAK256,3SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.06 mm
3.3 mm
Supply Voltage-Max
3.6 V
2.75 V
Supply Voltage-Min
3 V
2.25 V
Supply Voltage-Nom
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
GOLD OVER NICKEL
Terminal Form
FLAT
FLAT
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
36 mm
36 mm
Base Number Matches
3
3
Number of Logic Cells
2880
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Screening Level
MIL-STD-883 Class B
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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