A54SX32A-1CQ256B
vs
5962-9958602QXX
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
ACTEL CORP
|
| Package Description |
CERAMIC, QFP-256
|
CERAMIC, QFP-256
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A001.A.2.C
|
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
32000 TYPICAL GATES AVAILABLE
|
ALSO OPERATES AT 5V SUPPLY
|
| Clock Frequency-Max |
278 MHz
|
|
| Combinatorial Delay of a CLB-Max |
1.1 ns
|
0.9 ns
|
| JESD-30 Code |
S-CQFP-F256
|
S-CQFP-F256
|
| Length |
36 mm
|
36 mm
|
| Number of CLBs |
2880
|
2880
|
| Number of Equivalent Gates |
48000
|
32000
|
| Number of Inputs |
228
|
|
| Number of Logic Cells |
2880
|
|
| Number of Outputs |
228
|
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
2880 CLBS, 48000 GATES
|
2880 CLBS, 32000 GATES
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFF
|
GQFF
|
| Package Equivalence Code |
TPAK256,3SQ,20
|
TPAK256,3SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK, GUARD RING
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
MIL-STD-883 Class B
|
|
| Seated Height-Max |
3.3 mm
|
3.81 mm
|
| Supply Voltage-Max |
2.75 V
|
3.6 V
|
| Supply Voltage-Min |
2.25 V
|
3 V
|
| Supply Voltage-Nom |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
36 mm
|
36 mm
|
| Base Number Matches |
3
|
2
|
|
|
|
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