A54SX16A-1FG256IX79
vs
A54SX16A-FG256I
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI SOC PRODUCTS GROUP
Package Description
BGA,
LBGA,
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
Additional Feature
16000 TYPICAL GATES AVAILABLE
16000 TYPICAL GATES AVAILABLE
Clock Frequency-Max
263 MHz
Combinatorial Delay of a CLB-Max
1.2 ns
1.4 ns
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
JESD-609 Code
e0
e0
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1452
1452
Number of Equivalent Gates
24000
24000
Number of Terminals
256
256
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1452 CLBS, 24000 GATES
1452 CLBS, 24000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.97 mm
1.68 mm
Supply Voltage-Max
2.75 V
2.75 V
Supply Voltage-Min
2.25 V
2.25 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD/TIN LEAD SILVER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
17 mm
Base Number Matches
1
1
Pbfree Code
No
Part Package Code
BGA
Pin Count
256
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
30
Compare A54SX16A-1FG256IX79 with alternatives
Compare A54SX16A-FG256I with alternatives