A42MX36-FBGG272M
vs
A42MX36-1BG272I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
BGA,
PLASTIC, BGA-272
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
CAN ALSO BE OPERATED AT 3.3V I/O SUPPLY
ALSO OPERATES AT 5V SUPPLY
Combinatorial Delay of a CLB-Max
3.8 ns
2.3 ns
JESD-30 Code
S-PBGA-B272
S-PBGA-B272
JESD-609 Code
e1
e0
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1184
2438
Number of Equivalent Gates
54000
54000
Number of Terminals
272
272
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
1184 CLBS, 54000 GATES
1184 CLBS, 54000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA272,20X20,50
BGA272,20X20,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.5 mm
2.5 mm
Supply Voltage-Max
5.5 V
3.6 V
Supply Voltage-Min
4.5 V
3 V
Supply Voltage-Nom
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD SILVER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
Base Number Matches
3
3
Clock Frequency-Max
83 MHz
Number of Inputs
202
Number of Outputs
202
Packing Method
TRAY
Compare A42MX36-FBGG272M with alternatives
Compare A42MX36-1BG272I with alternatives