A42MX36-2BGG272I
vs
A42MX36-2BG272I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
ROHS COMPLIANT, PLASTIC, BGA-272
BGA,
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
ALSO OPERATES AT 5V SUPPLY
ALSO OPERATES AT 5V SUPPLY
Clock Frequency-Max
91 MHz
91 MHz
Combinatorial Delay of a CLB-Max
2.1 ns
2.1 ns
JESD-30 Code
S-PBGA-B272
S-PBGA-B272
JESD-609 Code
e1
e0
Length
27 mm
27 mm
Moisture Sensitivity Level
3
3
Number of CLBs
2438
2438
Number of Equivalent Gates
54000
54000
Number of Inputs
202
Number of Outputs
202
Number of Terminals
272
272
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
1184 CLBS, 54000 GATES
2438 CLBS, 54000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA272,20X20,50
BGA272,20X20,50
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Packing Method
TRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.5 mm
2.5 mm
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD SILVER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
27 mm
27 mm
Base Number Matches
3
3
Part Package Code
BGA
Pin Count
272
Peak Reflow Temperature (Cel)
225
Time@Peak Reflow Temperature-Max (s)
20
Compare A42MX36-2BGG272I with alternatives
Compare A42MX36-2BG272I with alternatives