Findchips: Compare A3P600L-1FG256YI vs A3P600L-1FG256I

A3P600L-1FG256YI vs A3P600L-1FG256I feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	No	No
Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	MICROSEMI CORP	MICROSEMI CORP
Package Description	BGA, BGA256,16X16,40	17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256
Reach Compliance Code	unknown	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	250 MHz	350 MHz
JESD-30 Code	S-PBGA-B256	S-PBGA-B256
JESD-609 Code	e0
Moisture Sensitivity Level	3	3
Number of Inputs	177	177
Number of Logic Cells	13824	13824
Number of Outputs	177	177
Number of Terminals	256	256
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	BGA	BGA
Package Equivalence Code	BGA256,16X16,40	BGA256,16X16,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified	Not Qualified
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	INDUSTRIAL
Terminal Finish	TIN LEAD
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Base Number Matches	3	2
Length		17 mm
Number of CLBs		13824
Number of Equivalent Gates		600000
Organization		13824 CLBS, 600000 GATES
Seated Height-Max		1.8 mm
Supply Voltage-Max		1.575 V
Supply Voltage-Min		1.14 V
Supply Voltage-Nom		1.2 V
Width		17 mm
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays