A3P600-2PQG208
vs
A3P600-1FG256YI
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI SOC PRODUCTS GROUP
|
| Package Description |
28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208
|
LBGA,
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.31.00.01
|
8542.39.00.01
|
| Factory Lead Time |
14 Weeks
|
|
| Clock Frequency-Max |
350 MHz
|
|
| JESD-30 Code |
S-PQFP-G208
|
S-PBGA-B256
|
| JESD-609 Code |
e3
|
e0
|
| Length |
28 mm
|
17 mm
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of CLBs |
13824
|
13824
|
| Number of Equivalent Gates |
600000
|
600000
|
| Number of Inputs |
154
|
|
| Number of Outputs |
154
|
|
| Number of Terminals |
208
|
256
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
13824 CLBS, 600000 GATES
|
13824 CLBS, 600000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
FQFP
|
LBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, FINE PITCH
|
GRID ARRAY, LOW PROFILE
|
| Packing Method |
TRAY
|
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
4.1 mm
|
1.7 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.425 V
|
1.425 V
|
| Supply Voltage-Nom |
1.5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD SILVER
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.5 mm
|
1 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
28 mm
|
17 mm
|
| Base Number Matches |
10
|
2
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
256
|
|
|
|
Compare A3P600-2PQG208 with alternatives
Compare A3P600-1FG256YI with alternatives