A3P600-1FG256YI
vs
A3P600-1FG256IY
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Package Description
LBGA,
FPBGA-256
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PBGA-B256
JESD-609 Code
e0
Length
17 mm
Moisture Sensitivity Level
3
Number of CLBs
13824
Number of Equivalent Gates
600000
Number of Terminals
256
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
1.7 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD SILVER
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
17 mm
Base Number Matches
3
2
Date Of Intro
2016-03-25
Compare A3P600-1FG256YI with alternatives
Compare A3P600-1FG256IY with alternatives