A3P600-2PQ208Y
vs
A3P600-FGG484I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI SOC PRODUCTS GROUP
MICROCHIP TECHNOLOGY INC
Part Package Code
QFP
Package Description
FQFP,
23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484
Pin Count
208
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-PQFP-G208
S-PBGA-B484
Length
28 mm
23 mm
Number of CLBs
13824
13824
Number of Equivalent Gates
600000
600000
Number of Terminals
208
484
Operating Temperature-Max
85 °C
100 °C
Operating Temperature-Min
-40 °C
Organization
13824 CLBS, 600000 GATES
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FQFP
BGA
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, FINE PITCH
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
4.1 mm
2.44 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
1 mm
Terminal Position
QUAD
BOTTOM
Width
28 mm
23 mm
Base Number Matches
4
6
Rohs Code
Yes
Factory Lead Time
8 Weeks
Clock Frequency-Max
350 MHz
JESD-609 Code
e1
Moisture Sensitivity Level
3
Number of Inputs
235
Number of Outputs
235
Peak Reflow Temperature (Cel)
250
Qualification Status
Not Qualified
Terminal Finish
TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)
30
Compare A3P600-2PQ208Y with alternatives
Compare A3P600-FGG484I with alternatives