A3P600-2PQ208Y vs A3P600-FGG484I feature comparison

A3P600-2PQ208Y Microsemi FPGA & SoC

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A3P600-FGG484I Microchip Technology Inc

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Part Life Cycle Code Transferred Active
Ihs Manufacturer MICROSEMI SOC PRODUCTS GROUP MICROCHIP TECHNOLOGY INC
Part Package Code QFP
Package Description FQFP, 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484
Pin Count 208
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PQFP-G208 S-PBGA-B484
Length 28 mm 23 mm
Number of CLBs 13824 13824
Number of Equivalent Gates 600000 600000
Number of Terminals 208 484
Operating Temperature-Max 85 °C 100 °C
Operating Temperature-Min -40 °C
Organization 13824 CLBS, 600000 GATES 13824 CLBS, 600000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FQFP BGA
Package Shape SQUARE SQUARE
Package Style FLATPACK, FINE PITCH GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 4.1 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 1 mm
Terminal Position QUAD BOTTOM
Width 28 mm 23 mm
Base Number Matches 4 6
Rohs Code Yes
Factory Lead Time 8 Weeks
Clock Frequency-Max 350 MHz
JESD-609 Code e1
Moisture Sensitivity Level 3
Number of Inputs 235
Number of Outputs 235
Peak Reflow Temperature (Cel) 250
Qualification Status Not Qualified
Terminal Finish TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s) 30

Compare A3P600-2PQ208Y with alternatives

Compare A3P600-FGG484I with alternatives