A3P600-1FG256II
vs
A3P600-1FG256IY
feature comparison
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256
|
FPBGA-256
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
350 MHz
|
|
JESD-30 Code |
S-PBGA-B256
|
|
Length |
17 mm
|
|
Number of CLBs |
13824
|
|
Number of Equivalent Gates |
600000
|
|
Number of Inputs |
177
|
|
Number of Outputs |
177
|
|
Number of Terminals |
256
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
13824 CLBS, 600000 GATES
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
BGA
|
|
Package Equivalence Code |
BGA256,16X16,40
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.8 mm
|
|
Supply Voltage-Max |
1.575 V
|
|
Supply Voltage-Min |
1.425 V
|
|
Supply Voltage-Nom |
1.5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Width |
17 mm
|
|
Base Number Matches |
2
|
2
|
Date Of Intro |
|
2016-03-25
|
|
|
|
Compare A3P600-1FG256II with alternatives
Compare A3P600-1FG256IY with alternatives