A3P600-1FG256I
vs
A3P600-1FG256YI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256
LBGA,
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
8 Weeks
Samacsys Manufacturer
Microchip
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
17 mm
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
13824
13824
Number of Equivalent Gates
600000
600000
Number of Inputs
177
Number of Outputs
177
Number of Terminals
256
256
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
13824 CLBS, 600000 GATES
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Packing Method
TRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
1.8 mm
1.7 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
17 mm
Base Number Matches
3
3
JESD-609 Code
e0
Terminal Finish
TIN LEAD SILVER
Compare A3P600-1FG256I with alternatives
Compare A3P600-1FG256YI with alternatives