A3P600-1FG256I vs A3P600-PQG208 feature comparison

A3P600-1FG256I Microchip Technology Inc

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A3P600-PQG208 Microchip Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Package Description 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 28 X 28 MM, 3.40 MM HEIGHT, 0.50 MM PITCH, GREEN, PLASTIC, QFP-208
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.31.00.01
Factory Lead Time 8 Weeks 14 Weeks
Samacsys Manufacturer Microchip Microchip
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PBGA-B256 S-PQFP-G208
Length 17 mm 28 mm
Moisture Sensitivity Level 3 3
Number of CLBs 13824 13824
Number of Equivalent Gates 600000 600000
Number of Inputs 177 154
Number of Outputs 177 154
Number of Terminals 256 208
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 13824 CLBS, 600000 GATES 13824 CLBS, 600000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA FQFP
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY FLATPACK, FINE PITCH
Packing Method TRAY TRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.8 mm 4.1 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.5 mm
Terminal Position BOTTOM QUAD
Width 17 mm 28 mm
Base Number Matches 6 10
ECCN Code EAR99
JESD-609 Code e3
Peak Reflow Temperature (Cel) 245
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 30

Compare A3P600-1FG256I with alternatives

Compare A3P600-PQG208 with alternatives