A3P400-FGG144I vs A3P400-2FG256 feature comparison

A3P400-FGG144I Microchip Technology Inc

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A3P400-2FG256 Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Package Description 13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144 BGA,
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 8 Weeks
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PBGA-B144 S-PBGA-B256
JESD-609 Code e1
Length 13 mm 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 9216 9216
Number of Equivalent Gates 400000 400000
Number of Inputs 97
Number of Outputs 97
Number of Terminals 144 256
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 9216 CLBS, 400000 GATES 9216 CLBS, 400000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA BGA
Package Equivalence Code BGA144,12X12,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.55 mm 1.8 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 13 mm 17 mm
Base Number Matches 3 3

Compare A3P400-FGG144I with alternatives

Compare A3P400-2FG256 with alternatives