A3P400-2FG484 vs A3P400-2FG484II feature comparison

A3P400-2FG484 Microsemi Corporation

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A3P400-2FG484II Microsemi Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description 23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484 BGA,
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-PBGA-B484 S-PBGA-B484
JESD-609 Code e0
Length 23 mm 23 mm
Moisture Sensitivity Level 3
Number of CLBs 9216 9216
Number of Equivalent Gates 400000 400000
Number of Inputs 194
Number of Outputs 194
Number of Terminals 484 484
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 9216 CLBS, 400000 GATES 9216 CLBS, 400000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.44 mm 2.44 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 23 mm 23 mm
Base Number Matches 18 2
Clock Frequency-Max 350 MHz

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