A3P400-2FG144
vs
A3P400-1FGG144Y
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI SOC PRODUCTS GROUP
Package Description
13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144
LBGA,
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
8 Weeks
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
JESD-609 Code
e0
e1
Length
13 mm
13 mm
Moisture Sensitivity Level
3
3
Number of CLBs
9216
9216
Number of Equivalent Gates
400000
400000
Number of Inputs
97
Number of Outputs
97
Number of Terminals
144
144
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Organization
9216 CLBS, 400000 GATES
9216 CLBS, 400000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA144,12X12,40
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Packing Method
TRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
1.55 mm
1.55 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD SILVER
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
13 mm
Base Number Matches
12
4
Part Package Code
BGA
Pin Count
144
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare A3P400-2FG144 with alternatives
Compare A3P400-1FGG144Y with alternatives