A3P250L-PQ208YI
vs
A3P250L-1FGG144Y
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
250 MHz
|
250 MHz
|
JESD-30 Code |
S-PQFP-G208
|
S-PBGA-B144
|
Length |
28 mm
|
|
Number of CLBs |
6144
|
|
Number of Equivalent Gates |
250000
|
|
Number of Inputs |
151
|
97
|
Number of Logic Cells |
6144
|
6144
|
Number of Outputs |
151
|
97
|
Number of Terminals |
208
|
144
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
6144 CLBS, 250000 GATES
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
BGA
|
Package Equivalence Code |
QFP208,1.2SQ,20
|
BGA144,12X12,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
GRID ARRAY
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max |
1.575 V
|
|
Supply Voltage-Min |
1.14 V
|
|
Supply Voltage-Nom |
1.2 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
1 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
28 mm
|
|
Base Number Matches |
3
|
3
|
Package Description |
|
BGA, BGA144,12X12,40
|
JESD-609 Code |
|
e1
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare A3P250L-PQ208YI with alternatives
Compare A3P250L-1FGG144Y with alternatives